Silicon nitride bonded silicon carbide bricks
SiC : 72%
Bulk density : 2.65g/cm³
Apparent porosity : 16%
Cold crushing strength : 180 MPa
PRODUCT DESCRIPTION
Introduction
Silicon nitride bonded silicon carbide brick is a high-performance non-oxide refractory material. It adopts SiC particles as the main skeleton, with silicon powder as raw material, and is sintered in nitrogen atmosphere. In-situ formed silicon oxynitride acts as the bonding phase to connect SiC grains tightly. It is widely used for high-temperature industrial furnace linings.
Features
High-Temperature Structural Stability: The continuous Si₂ON₂ ceramic bonding network endows the brick excellent hot strength retention and low high-temperature creep. It effectively resists high-temperature abrasion, flue gas scouring and thermal structural deformation under long-term thermal load.
Excellent Thermal Shock Resistance: Low thermal expansion coefficient and matched thermal conductivity suppress crack initiation and propagation under rapid temperature cycling. The material maintains intact structure with superior anti-spalling performance during frequent furnace operation.
Superior Chemical Stability: The oxynitride matrix possesses high chemical inertness. It provides excellent resistance against high-temperature oxidation, CO corrosion, alkaline slag penetration and molten non-ferrous metal infiltration in harsh service environments.
Applications
Blast furnace lining, iron runners, heating furnace components, continuous casting accessories.
TECHNIQUE DATA
Si₃N₄ Bonded SiC Brick
| Index | ATG-72A | ATG-72B | |
| SiC, % | ≥ | 72 | 72 |
| Si₃N₄, % | ≥ | 22 | 20 |
| Fe₂O₃, % | ≤ | 0.5 | 0.7 |
| Si, % | ≤ | 0.5 | 0.5 |
| Apparent porosity ,% | ≤ | 16 | 17 |
| Bulk density ,g/cm³ | ≥ | 2.68 | 2.65 |
| Cold crushing strength ,MPa | ≥ | 180 | 160 |
| MOR,MPa | ≥ | 45 | 42 |
| HMOR (1400℃×0.5h) ,MPa | ≥ | 45 | 45 |
| Thermal expansion coefficient (1350℃), 1/℃ | ≤ | 4.2×10⁻⁶ | 4.4×10⁻⁶ |
| Thermal conductivity ,W/m・k | 1000℃ | ≥17 | ≥17 |
| 350℃ | ≥23 | ≥23 |
Online Message
* Note: Please be sure to fill in the information accurately and keep the communication open. We will contact you as soon as possible

